PMP Practice Questions #84
You are a Project Manager reviewing a Pareto chart provided by your quality control team. The chart outlines the frequency of various defect types in the electronic product manufacturing process. The identified defects are soldering errors, circuit design flaws, component failures, and packaging damages. The chart shows soldering errors contributing to about 70% of all defects, circuit design flaws at 15%, component failures at 10%, and packaging damages at 5%. It’s also noted that a recent efficiency drive has led to slight modifications in soldering and packaging processes.
Given this information, which action should be your priority to enhance the manufacturing process effectively?
A) Overhaul the packaging process completely to minimize damages, considering the recent changes.
B) Conduct a thorough analysis of the soldering process to identify and address root causes of errors, while evaluating the impact of recent efficiency measures.
C) Implement an advanced training program for the circuit design team to address the second-most frequent defect category.
D) Initiate a supplier review process to potentially replace component suppliers, aiming to reduce component failure rates.
Analysis:
This question centers around the use of a Pareto chart in identifying and prioritizing defect types in an electronic product manufacturing process. The Pareto principle, or the 80/20 rule, suggests focusing on the few causes that lead to the majority of problems. In this scenario, soldering errors are identified as the major defect, contributing to 70% of all issues. The question is testing the understanding of prioritizing actions based on the Pareto analysis.
Analysis of Options:
Option A: Overhaul the packaging process completely to minimize damages, considering the recent changes. Overhauling the packaging process, which accounts for only 5% of defects, is not aligned with the Pareto principle’s guidance and would not significantly impact overall defect reduction.
Option B: Conduct a thorough analysis of the soldering process to identify and address root causes of errors, while evaluating the impact of recent efficiency measures. Conducting a thorough analysis of the soldering process, which is responsible for the majority of defects, is the most effective approach. It addresses the primary source of defects and also considers the impact of recent changes in the process.
Option C: Implement an advanced training program for the circuit design team to address the second-most frequent defect category. Implementing an advanced training program for circuit design, responsible for 15% of defects, while important, does not address the most significant defect source and therefore is not the most immediate priority.
Option D: Initiate a supplier review process to potentially replace component suppliers, aiming to reduce component failure rates. Initiating a supplier review process for component failures, accounting for 10% of defects, is a lower priority compared to soldering errors and does not address the most pressing issue.
Conclusion: Based on the Pareto chart analysis, the primary focus should be on addressing the most significant source of defects. Option B is the best course of action as it targets soldering errors, which constitute the majority of defects. This approach not only aligns with the Pareto principle but also promises the most substantial impact on improving overall quality. It’s essential to address the most pressing issue first, and in this case, it’s the soldering process. Therefore, Option B is the most appropriate and effective choice for enhancing the manufacturing process.
PMP Exam Content Outline Mapping
| Domain | Task |
|---|---|
| Process | Task 7: Plan and manage quality of products/deliverables |
Topics Covered
- Quality Tools : Pareto chart
